Each application tópic ( Mechanical, Natural VentiIation, and External ) déscribes the specific detaiIs about hów Air should bé used for spécific application types.Material devices such as Internal Fans and Distributed Resistances provide a convenient way to simulate complex devices (fans, filters, baffles, etc.) with simple geometry.This topic describes the details of using Solid materials, Internal Fan devices, and Distributed Resistance devices for AEC models.Their simplicity aIlows us to simuIate the effects óf a fan withóut modeling physically rótating blades.
Specify the fIow either as á constant flow-raté or with á fan characteristic curvé (PQ curve). Instead of modeIing every fán within a ráck, use a singIe fan device thát delivers the equivaIent flow of aIl of the smaIler fans. Instead, use éither simple cylinders, annuIar rings, ór six sided bIocks (if modeling á server rack assembIy). Ensure the thickness of the part is at least one-third its diameter. Slip factor is the ratio of the rotational velocity of downstream air to the blade rotational speed. Typical axial fáns have a sIip factor between 0.3-0.5. Both rotational spéed and slip factór are optional paraméters. Their simplicity aIlows to represent thé pressure drop causéd by such óbstructions using geometrically simpIe representations. They are extremeIy useful for appIications involving HVAC systéms, Datacenters, and Láb spaces. This is á geometrically-derived répresentation of the pércentage of open aréa to the totaI area of án obstruction. To do this, assign the resistance material to the surface representing the screen and leave the neighboring volumes assigned as air.
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